Congatec

Advantages of Computer-on-Modules

• A single carrier board design enables multiple product lineups.
• CPU and memory acceleration require time and resources for CPU peripheral design.
• However, it is difficult to differentiate performance in the CPU component.
• Costs incurred in designing and developing the CPU component, where performance differentiation is challenging, can be redirected toward functional performance and application development, where differentiation from competitors is possible.
• In a few years, it will be possible to upgrade to a more powerful, low-power, latest-generation CPU simply by replacing the CPU module, without any design changes.

Qseven

Rev. 2.0

SMARC

Rev. 2.0

COM Express

Mini Type 10

COM Express

Compact Type 6

COM Express

Basic Type 6&7

COMCOM HPC

Cooling Solution

The highest-performance cooling solution for server-class CPUs in COM Express Type 7 modules.

Congatec's powerful active cooling solution delivers the highest performance and reliability.

• Combining air cooling and heat pipes, it delivers powerful cooling performance, suppressing heat generation in key components such as the CPU and memory within the chassis, enabling operation at maximum performance.
• Cooling effects can also be expected not only for key components but also for the chassis.